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Analysis of Defects on PCB Using Modern Optical Method
Vala, Martin ; Řezníček, Michal (referee) ; Řihák, Pavel (advisor)
This diploma thesis is focused on detecting of defects on BGA (Ball Grid Array) components using of X-ray. Defects are formed during reflow BGA components during assembly, but also later due to mechanical and thermal stress. Therefore, there is an overview of defects and methods of diagnosis of BGA packages eg .: modern X-ray defect detection or micro sections. There is disclosed a device NORDSON DAGE XD7600NT its operation and setup. The device enables advanced methods of scanning called X-plane. For creating 3D models used reconstructive software called CERA, which uses raw data from the method of X-Plane.
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Mechanical Properties of solder joint
Meliš, Josef ; Starý, Jiří (referee) ; Stejskal, Petr (advisor)
This thesis deals with the differences between the mechanical properties of surface conditionings of the printed circuit boards and various types of soldering pastes. The practical part of the thesis describes all the steps necessary to conduct the experiment. The experiment will evaluate the measured mechanical strength of the solder joint for each surface conditioning, the types of solders, the increase in thickness of the intermetalic layer during long-term aging and the change in the structure of the solder joint.
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Selective Soldering
Stoklásek, Lukáš ; Petr, Martinec (referee) ; Starý, Jiří (advisor)
This diploma thesis introduces the problematics of selective soldering. The theoretical part deals with description of soldering process and its possibilitites, use of this processes for selective soldering and the control of production. The practical part describes the methodics of measuring the amount and uniformity of flux applied on printed circuit boards, effects and stability of preheaters and dwell time if PCB in the soldering wave. The next part deals with the production test for the certain product, cleanness of the single processes, x-ray diagnostics and cross section of the boards. In the end is economic evaluation of the processes. The main object of this thesis is to suggest the optimal production process for the product.
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PCB Production and Process Optimizing
Schnederle, Petr ; Blansko, Jiří Zouhar, ČEMEBO (referee) ; Starý, Jiří (advisor)
Bachelor's thesis describes the problems of production of printed circuit boards. It focuses on issues of production 1V and 2V DPS subtractive method pattern plating and related activities. Includes analysis of double-layer PCB using microsection and examples of possible defects in the production. The work is aimed at optimizing the production process in fa Čemebo Blansko Ltd. Shows the deployment of machines and technology flows in the company, then provides recommendations to streamline the flow. It also includes recommendations for retrofitting other appropriate facilities and recommendations for optimization of existing facilities.
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Bismuth Low Temperature Solder Pastes
Švéda, Miloš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with bismuth low temperature solder pastes. Describes the properties of bismuth solder pastes. It shows the process of manufacturing a printed circuit board for test. The thesis also characterizes laboratory temperature profile setting for the BiSn soldering pastes. Solder paste printing and placement 0 ohm rezistors to printed circuit boards with different surface finishes in the manufacturing plant. Setting of solder profiles for low soldering pastes in reflow oven. Testing resistence of mounted zero resistor on the test board at different aging temperature were analysed. Resistance measurement after a specified time. Testing of solder joint strenght of printed circuit boards for different surface treatments. Changes in structure wereanalysed on microsections for solder pastes.
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Selective Soldering
Stoklásek, Lukáš ; Petr, Martinec (referee) ; Starý, Jiří (advisor)
This diploma thesis introduces the problematics of selective soldering. The theoretical part deals with description of soldering process and its possibilitites, use of this processes for selective soldering and the control of production. The practical part describes the methodics of measuring the amount and uniformity of flux applied on printed circuit boards, effects and stability of preheaters and dwell time if PCB in the soldering wave. The next part deals with the production test for the certain product, cleanness of the single processes, x-ray diagnostics and cross section of the boards. In the end is economic evaluation of the processes. The main object of this thesis is to suggest the optimal production process for the product.
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Bismuth Low Temperature Solder Pastes
Švéda, Miloš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with bismuth low temperature solder pastes. Describes the properties of bismuth solder pastes. It shows the process of manufacturing a printed circuit board for test. The thesis also characterizes laboratory temperature profile setting for the BiSn soldering pastes. Solder paste printing and placement 0 ohm rezistors to printed circuit boards with different surface finishes in the manufacturing plant. Setting of solder profiles for low soldering pastes in reflow oven. Testing resistence of mounted zero resistor on the test board at different aging temperature were analysed. Resistance measurement after a specified time. Testing of solder joint strenght of printed circuit boards for different surface treatments. Changes in structure wereanalysed on microsections for solder pastes.
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